Our research evolves in a context of higher and higher frequencies and data rates, ultra-low-power devices and increasing functional densification.
They face the problem of the reconfigurability of RF electronic functions.
1- High frequency measurement methods:
Wideband characterization techniques (DC to 110 GHz) of materials
Calibration and de-embedding techniques for integrated device characterization
In-situ techniques for characterization of very thin films (nm) to bulk (mm) materials
2- Characterization of materials for integrated devices, sensors, printed electronics devices and MEMS
Characterization of dielectric materials ferroelectric and piezoelectric materials of semiconductor and conductor materials
Characterization of printed electronics materials (links, papers)
3- Development, design and characterization of new integrated passive devices and MEMS
3D RF MIM capacitors, new high density 3D capacitors (TSC, Nanowires capacitors)
High speed Interconnections for sub-45 nm CMOS nodes
3D Packaging
AF-SIW lntegrated devices for spatial applications